چکیده مقاله
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin based lead free solders with physical and mechanical properties similar to old tin lead alloys In this regard, the set of Sn Ag Cu alloys with eutectic and near eutectic compositions have been proposed to replace Sn Pb solders As a lead free solder alloy, low melting point, high reliability, and compatibility with various fluxes are among the properties of this category of alloys In order to improve the properties of the joint, these solders are sometimes reinforced with different nanoparticles In this study, Sn0 3Ag0 7Cu compound reinforced with graphene nanosheets with different weight percentages 0, 0 05, 0 1, and 0 2 was studied Microstructure of the alloys was investigated by scanning electron microscopy SEM andoptical microscopy Melting temperature, wetting behavior and electrical resistivity of the solders were evaluated According to the results, by adding graphene nanosheets, the wetting angle of the solder first decreased and then increased This parameter showed the optimal amount for sample containing 0 1% graphene nanosheets with a 10% reduction The melting point and electrical resistance of the solder alloy did not change significantly with compositing With the addition of graphene nanosheets, the thickness of the intermetallic compounds Cu6Sn5 present at the interface between copper and solder wasreduced up to 30%
کلیدواژهها
نویسندگان
Sajjad Azghandi Rad
Master degree, Department of material science and engineering, IRAN
مجتبی موحدی
Associate professor, Department of material science and engineering, IRAN
Amirhossein Kokabi
Professor, Department of material science and engineering, IRAN
Moein Tamizi
PHD student, Department of material science and engineering, IRAN
شیوه ارجاع
Azghandi Rad, Sajjad and Movahedi, Mojtaba and Kokabi, Amirhossein and Tamizi, Moein,1400,Microstructure / Physical properties investigation in lead free solder reinforced with graphene nanosheets (SAC0307+GNSs),4th International Conference on Welding and Non Destructive Testing & 22nd National Conference on Welding & Inspection & 11th National Conference on NDT,Isfahan
ارائهشده در
مجموعه مقالات چهارمین کنفرانس بین المللی جوشکاری و آزمایش های غیرمخرب و بیست و دومین کنفرانس ملی جوش و بازرسی و یازدهمین کنفرانس ملی آزمایش های غیرمخرب18 اسفند 1400 · اصفهان