چکیده مقاله
The increasing number of electronics has resulted in the durability of the solder joiningbeing one ofthe factors affecting the lifespan ofthese devices Nowadays, environmentaland human health concerns have prohibited the use of Sn Pb solders due to the presenceof toxic lead Therefore, various research have been performed to replace the Sn Pbsolders with lead free solders In this study, first, an Sn 0 89%wtZn solder alloy wasproduced and characterized using the Accumulated Extrusion ECAP method, Sn sheetsand Zn powder The result demonstrated that 12 passes of deformation without usinglubricants or surface treatments caused the proper dispersion of Zn powder in the Snmatrix Increasing the number ofpasses enhanced the adhesion ofthe layers to each otherand 90° rotation between the passes improved the Zn powder dispersion in the matrix Shear strength of the produced Sn Zn was found to be about 60% higher than that of acommercially available Sn Pb alloy The contact angle of the reflown Sn Zn solder on aCu substrate was about 21 ° which was acceptable but more than that of the commercialSn Pb solderThe increasing number of electronics has resulted in the durability of the solder joiningbeing one ofthe factors affecting the lifespan ofthese devices Nowadays, environmentaland human health concerns have prohibited the use of Sn Pb solders due to the presenceof toxic lead Therefore, various research have been performed to replace the Sn Pbsolders with lead free solders In this study, first, an Sn 0 89%wtZn solder alloy wasproduced and characterized using the Accumulated Extrusion ECAP method, Sn sheetsand Zn powder The result demonstrated that 12 passes of deformation without usinglubricants or surface treatments caused the proper dispersion of Zn powder in the Snmatrix Increasing the number ofpasses enhanced the adhesion ofthe layers to each otherand 90° rotation between the passes improved the Zn powder dispersion in the matrix Shear strength of the produced Sn Zn was found to be about 60% higher than that of acommercially available Sn Pb alloy The contact angle of the reflown Sn Zn solder on aCu substrate was about 21 ° which was acceptable but more than that of the commercialSn Pb solder
کلیدواژهها
نویسندگان
Mohammad Kian Vojdanpak
Master of science, Isfahan University of Technology, Iran
Ali Maleki
Associate Professor, Isfahan University of Technology, Iran
Behzad Niroumand
Professor, Isfahan University of Technology, Iran
شیوه ارجاع
Vojdanpak, Mohammad Kian and Maleki, Ali and Niroumand, Behzad,1401,Fabrication and characterization of Sn-Zn lead free solder,5th International Conference on Welding and Non Destructive Testing & 23rd National Conference on Welding & Inspection & 12th National Conference on NDT,Isfahan
ارائهشده در
مجموعه مقالات پنجمین کنفرانس بین المللی جوشکاری و آزمایش های غیرمخرب،بیست و سومین کنفرانس ملی جوش و بازرسی و دوازدهمین کنفرانس ملی آزمایش های غیرمخرب و اولین کنفرانس ملی ساخت افزایشی10 اسفند 1401 · اصفهان