چکیده مقاله
In the present study, Transient Liquid Phase TLP bonding of15 5PH stainless steel wascarried out by using BNi 3 interlayer The bonding process was carried out at 1150oC for5min and 30min under protection of 99 995% Ar shielding gas The microstructuralinvestigations of the bonding area was carried by using optical and scanning electronmicroscopes equipped to EDS analyzer Cooling the samples before the completion ofthermal solidification causes non isothermal solidification of the remaining melt in thecentral line of bonding zone and the formation of boride compounds Microstructuralstudies showed that increasing the joining time from 5min to 30min results in completionof isothermal solidification and the formation ofa uniform nickel rich solid solution in atthe bonding zone The continuous morphology of the eutectic compounds formed duringnon isothermal solidification caused a sharp drop in the shear strength of the bondedspecimens Applying thermal aging treatment after joining led to modification of the sizeof martensite laths and uniformity hardness in the joint area
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شیوه ارجاع
Mosallaee Pour, Masoud and Naderi, Mohammad Amin and Houshangi, Mostafa and Babanejad, Afshin,1401,Microstructural and mechanical evaluation of 15-5PH SS/BNi-3/15-5PHSS bonded by TLP process,5th International Conference on Welding and Non Destructive Testing & 23rd National Conference on Welding & Inspection & 12th National Conference on NDT,Isfahan
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مجموعه مقالات پنجمین کنفرانس بین المللی جوشکاری و آزمایش های غیرمخرب،بیست و سومین کنفرانس ملی جوش و بازرسی و دوازدهمین کنفرانس ملی آزمایش های غیرمخرب و اولین کنفرانس ملی ساخت افزایشی10 اسفند 1401 · اصفهان