چکیده مقاله
Composite solders are widely used in various electronic applications, especially in high current density environments In this study, solder foils were created by adding 0 2 weight percent of cobalt to a low silver lead free, Sn 0 3Ag 0 7Cu SAC0307 solder, using a casting alloying method followed by accumulative roll bonding These solder foils were then subjected to aging heat treatment at 75°C for various durations: 50, 150, 450, and 1000 hours After aging, the microstructural and mechanical properties of the solder and solder joint were carefully analyzed To evaluate the mechanical properties, shear tensile tests were conducted on the heat treated solders Additionally, the joint characteristics, including the microstructure of the solder matrix and the intermetallic compounds IMCs at the interface, were examined using scanning electron microscope SEM The findings revealed that adding cobalt led to an increase in the thickness of the intermetallic compounds after 1000 hours of aging The IMC thickness increased by ⁓40% for SAC0307 and ⁓23% for SAC0307 0 2Co As the aging time increased, the size and thickness of the intermetallic compounds also increased The diffusion controlled growth coefficient k for both SAC0307 and SAC0307 0 2Co at 75°C was calculated to be 3 268×10 19 and 3 044×10 19 m²/s, respectively Moreover, the morphology of the interfacial intermetallic compounds became flatter over time The shear tensile test results showed that after 1000 hours of aging, the shear strength of the joints decreased by ⁓26% for SAC0307 and ⁓4 % for SAC0307 0 2Co These results highlighted the impact of cobalt addition and aging time on the micro structural and mechanical behavior of the solder
کلیدواژه‌ها
نویسندگان
Kimia Nazari
Department of Materials Science and Engineering, Sharif University of Technology,
Mojtaba Movahed
Department of Materials Science and Engineering, Sharif University of Technology,
Ilia Hamidi Fard
, Department of Materials Science and Engineering, Sharif University of Technology,
شیوه ارجاع
Nazari, Kimia and Movahed, Mojtaba and Hamidi Fard, Ilia,1403,Investigating effect of aging time on microstructure and mechanical properties of lead-free Sn-Ag-Cu/Co composite solder on copper substrate,7th International Conference on Welding and Non Destructive Testing & 25th National Conference on Welding & Inspection & 14th National Conference on NDT & 3nd National Conference on Additive Manufacturing,Tehran
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