Investigation of microstructure and tensile strength of TLP in the joint of AA2024-T4 alloys to AA6061-T6 using Sn-2.4Bi interlayer
AA2024 T4 and AA6061 T6 alloys were joined by diffusion bonding 50μm tick Sn 2 4Bi foil was used as interlayer Specimens with dimension of 130×32×3mm…
Diffusion bondingTransient Liquid PhaseSoldering