Soldering

Investigation of microstructure and tensile strength of TLP in the joint of AA2024-T4 alloys to AA6061-T6 using Sn-2.4Bi interlayer

AA2024 T4 and AA6061 T6 alloys were joined by diffusion bonding 50μm tick Sn 2 4Bi foil was used as interlayer Specimens with dimension of 130×32×3mm…

Investigation of microstructure and mechanical properties of lead freecomposite solder containing cobalt microparticles produced byaccumulative roll bonding

The miniaturization and compaction trends in electronic equipment and the removal oflead Pb element from solder alloys due to environmental considera…