چکیده مقاله
Transient liquid phase bonding was used to join a low carbon manganese steel st52 at 1423K 1150C with copper interlayers of 10, 30 and 50μm thicknesses Microstructure studies indicated that isothermal solidification completion time decreased with decreasing interlayer thickness Bonded samples that achieved completed isothermal solidification were homogenized at 1003K 730C for 75 minutes and then quenched into cold water to assess final bond microstructure and strength This heat treatment cycle resulted in transformation of both the parent alloy and joint region into ferrite martensite dual phase microstructure Mechanical tests showed that the joint micro hardness is greater than the parent alloy in both homogenized and un homogenized bonded samples Shear strength tests results showed that the shear strength of homogenized bonded samples increased a little with increasing the interlayer thickness These differences were related to microstructure and distribution of alloying elements within the joint and parent alloy
کلیدواژهها
نویسندگان
A.H Zahiri
Department of Materials Science and Engineering, Sharif University of Technology, P O Box ۱۱۳۶۵ ۹۴۶۶, Tehran, Iran
A. Ekrami
Department of Materials Science and Engineering, Sharif University of Technology, P O Box ۱۱۳۶۵ ۹۴۶۶, Tehran, Iran
شیوه ارجاع
Zahiri, A.H and Ekrami, A.,1395,Microstructure and mechanical properties of TLP bonded a low C–Mn steel using copper interlayer with different thickness,The second international conference on welding and non-destructive testing, the 17th national conference on welding and inspection, and the sixth national conference on non-destructive testing,Isfahan
ارائهشده در
مجموعه مقالات دومین کنفرانس بین المللی جوشکاری و آزمایش های غیرمخرب، هفدهمین کنفرانس ملی جوش و بازرسی و ششمین کنفرانس ملی آزمایش های غیرمخرب30 آذر 1395 · اصفهان