چکیده مقاله
Thin film deposition is a fundamental process in microelectronic fabrication, as it directly influences the performance, reliability, and scaling of integrated circuits Various deposition techniques have been developed to meet the stringent material and process requirements of modern microelectronics This review presents an overview of the most widely used thin film deposition methods, including Physical Vapor Deposition PVD , Chemical Vapor Deposition CVD , and epitaxial growth techniques Special emphasis is placed on plasma assisted processes such as sputtering and Plasma Enhanced Chemical Vapor Deposition PECVD , which enable lower processing temperatures and improved control over film properties The advantages, limitations, and typical applications of each technique are discussed This review aims to provide a clear comparison of thin film deposition methods and highlight their importance in contemporary microelectronic technology
کلیدواژهها
نویسندگان
Amirabbas Sadiddast
۱ Master's student, Faculty of Microelectronics, Imam Hossein University, Tehran, Iran
Seyyed Mohammad Alavi
۲ Associate Professor, Faculty of Microelectronics, Imam Hossein University IHU , Tehran, Iran
شیوه ارجاع
Sadiddast, Amirabbas and Alavi, Seyyed Mohammad,1404,Thin Film Deposition Techniques in Microelectronics,29th National Conference on Electrical, Computer and Mechanical Engineering,Shirvan
ارائهشده در
مجموعه مقالات بیست و نهمین کنفرانس ملی مهندسی برق ،کامپیوتر و مکانیک28 بهمن 1404 · شیروان